{"id":435266,"date":"2024-10-20T07:48:40","date_gmt":"2024-10-20T07:48:40","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-61784-1-62023\/"},"modified":"2024-10-26T14:48:07","modified_gmt":"2024-10-26T14:48:07","slug":"bs-en-iec-61784-1-62023","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-61784-1-62023\/","title":{"rendered":"BS EN IEC 61784-1-6:2023"},"content":{"rendered":"
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | Blank Page <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 3 Terms, definitions, abbreviated terms, symbols, and conventions 3.1 Terms and definitions 3.2 Abbreviations and symbols 3.2.1 Common abbreviations and symbols 3.2.2 Other abbreviations and symbols 3.3 Conventions <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 4 CPF 6 (INTERBUS\u00ae) 4.1 General overview Tables Table 1 \u2013 CPF 6: device CP identifier assignment <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 4.2 CP 6\/1 4.2.1 Physical layer Table 2 \u2013 CPF 6: PhL selection <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 4.2.2 Data-link layer <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Table 3 \u2013 CP 6\/1: DLL service selection, assignment of DLL services to device types <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 4.2.3 Application layer Table 4 \u2013 CPF 6: DLL protocol selection of data widths supported by master <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 4.3 CP 6\/2 4.3.1 Physical layer Table 5 \u2013 CP 6\/1: AL service selection, assignment of AL services to device types <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 4.3.2 Data-link layer Table 6 \u2013 CP 6\/2: DLL service selection, assignment of DLL services to device types <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 4.3.3 Application layer Table 7 \u2013 CP 6\/2: AL service selection, assignment of AL services to device types <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 4.4 CP 6\/3 4.4.1 Physical layer 4.4.2 Data-link layer Table 8 \u2013 CP 6\/2: AL service selection of AR-Data-Send-Acknowledge service parameters <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 4.4.3 Application layer Table 9 \u2013 CP 6\/3: DLL service selection, assignment of DLL services to device types <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Table 10 \u2013 CP 6\/3: AL service selection, assignment of AL services to device types <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Annex A (informative)CPF 6 (INTERBUS) communication concepts <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Industrial networks. Profiles – Fieldbus profiles. Communication Profile Family 6<\/b><\/p>\n |