{"id":363735,"date":"2024-10-20T01:47:12","date_gmt":"2024-10-20T01:47:12","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-62435-72021\/"},"modified":"2024-10-26T02:48:28","modified_gmt":"2024-10-26T02:48:28","slug":"bs-en-iec-62435-72021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-62435-72021\/","title":{"rendered":"BS EN IEC 62435-7:2021"},"content":{"rendered":"
IEC 62435-7:2020 on long-term storage applies to micro-electromechanical devices (MEMS) in long-term storage that can be used as part of obsolescence mitigation strategy. Long-term storage refers to a duration that may be more than 12 months for products scheduled for storage. Philosophy, good working practice, and general means to facilitate the successful long-term storage of electronic components are also addressed.<\/p>\n
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 4 Storage considerations 4.1 Overview of MEMS applications 4.2 Failure mechanisms 4.2.1 Occurrence of failure and driving force <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Tables Table 1 \u2013 Failure mechanisms in storage and stimuli to mitigate during storage <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 4.2.2 Storage environment and mitigation for stimuli to prevent failure <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 4.3 Materials management 4.4 Storage media Table 2 \u2013 Long-term environment \u2013 sustained condition requirements Table 3 \u2013 Considerations for management, control and documentation during storage <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 4.5 Documentation\/paper lot identifiers 4.6 Inventory check 4.7 Inventory dry packing refreshing 4.8 Inventory re-assessment 5 Baseline long-term storage requirements 5.1 General <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 5.2 Moisture sensitivity designation 5.3 Dry packing for storage 5.4 Non-moisture sensitive device storage 5.4.1 General 5.4.2 Storage media 5.4.3 Lot data and labelling 5.5 Storage of MEMS devices before assembly \u2013 Wafer level and die level storage 5.6 Storage of moisture sensitive finished devices 5.6.1 Moisture barrier bag <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 5.6.2 Dunnage 5.6.3 Humidity indicator card 5.6.4 Desiccant 5.6.5 Labelling 5.6.6 Lot data and labelling <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 5.6.7 Storage environment 5.6.8 Process (temperature) sensitivity designation <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Annex A (informative)Packaged or finished device storage environment considerations Table A.1 \u2013 Long-term storage environment \u2013 sustained condition considerations <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Electronic components. Long-term storage of electronic semiconductor devices – Micro-electromechanical devices<\/b><\/p>\n |