IEC 60317-36:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE – A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this part is: – Grade 1B: 0,020 mm up to and including 1,600 mm; – Grade 2B: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: – new 3.2.2 containing general notes on winding wire, formerly a part of the scope; – revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; – consolidation of 17.1 and 17.2 of the solderability requirements; – new Clause 23, Pin hole test. Keywords: requirements of solderable enamelled round copper winding wire, class 180, dual coating<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | 1 Scope 2 Normative references 3 Terms, definitions, general notes and appearance 3.1 Terms and definitions 3.2 General notes 3.2.1 Test methods 3.2.2 Winding wire <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 3.3 Appearance 4 Dimensions 5 Electrical resistance 6 Elongation 7 Springiness 8 Flexibility and adherence 9 Heat shock 10 Cut-through 11 Resistance to abrasion (nominal conductor diameters from 0,250\u00a0mm up to and including 1,600\u00a0mm) <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 12 Resistance to solvents 13 Breakdown voltage 14 Continuity of insulation 15 Temperature index 16 Resistance to refrigerants Table 1 \u2013 Resistance to abrasion <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 17 Solderability 17.1 Nominal conductor diameters up to and including 0,100\u00a0mm 17.2 Nominal conductor diameters over 0,100\u00a0mm 18 Heat or solvent bonding 18.1 Heat bonding 18.1.1 Heat bonding strength of a helical coil <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 18.1.2 Bond strength on a twisted coil Table 2 \u2013 Loads <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 18.2 Solvent bonding 19 Dielectric dissipation factor 20 Resistance to transformer oil 21 Loss of mass 23 Pin hole test 30 Packaging <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Specifications for particular types of winding wires – Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer<\/b><\/p>\n |