IPC 9701A:2006

$27.95

Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Published By	Publication Date	Number of Pages
IPC	2006-02-01	36

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Description

Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments. Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints.

Additional information

Published Code	IPC
Published By	IPC International Inc, formerly Institute for Printed Circuits
Publication Date	2006-02-01
Pages Count	36
Language	English
File Size	870.4 KB

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IPC 9701A:2006

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