BSI PD IEC/TS 61967-3:2014
$167.15
Integrated circuits. Measurement of electromagnetic emissions – Measurement of radiated emissions. Surface scan method
| Published By | Publication Date | Number of Pages |
| BSI | 2014 | 38 |
This part of IEC 61967 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used.
This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be carried out in the frequency domain or in the time domain.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | English CONTENTS |
| 7 | FOREWORD |
| 9 | INTRODUCTION |
| 10 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviations 3.1 Terms and definitions |
| 11 | 3.2 Abbreviations 4 General |
| 12 | 5 Test conditions 5.1 General 5.2 Supply voltage 5.3 Frequency range 6 Test equipment 6.1 General 6.2 Shielding 6.3 RF measuring instrument 6.4 Preamplifier |
| 13 | 6.5 Cables 6.6 Near-field probe 6.6.1 General 6.6.2 Magnetic (H) field probe 6.6.3 Electric (E) field probe 6.6.4 Combined electric and magnetic (E/H) field probe 6.6.5 Probe-positioning and data acquisition system |
| 14 | 7 Test setup 7.1 General 7.2 Test configuration Figures Figure 1 – Example of probe-positioning system |
| 15 | Figure 2 – One-input RF measurement setup Figure 3 – Two-input RF measurement setup with reference probe Figure 4 – Two-input RF measurement setup with reference signal |
| 16 | 7.3 Test circuit board 7.4 Probe-positioning system software setup 7.5 DUT software 8 Test procedure 8.1 General 8.2 Ambient conditions 8.3 Operational check |
| 17 | 8.4 Test technique |
| 18 | 9 Test report 9.1 General 9.2 Measurement conditions 9.3 Probe design and calibration 9.4 Measurement data Figure 5 – Examples of data overlaid on an image of the DUT (Contour chart) |
| 19 | 9.5 Post-processing 9.6 Data exchange |
| 20 | Annex A (normative) Calibration of near-field probes A.1 General |
| 21 | Tables Table A.1 – Probe factor linear units Table A.2 – Probe factor logarithmic units |
| 22 | A.2 Test equipment A.2.1 General A.2.2 PCB with microstrip line Figure A.1 – Typical probe factor against frequency |
| 23 | A.3 Calibration setup Figure A.2 – Microstrip line for calibration (transverse cross-section) Figure A.3 – Microstrip line for calibration (longitudinal cross-section) Table A.3 – Dimensions for 50 microstrip |
| 24 | A.4 Calibration procedure Figure A.4 – Probe calibration setup Figure A.5 – Scan direction across Microstrip line |
| 26 | Figure A.6 – Typical plot of measured signal level and simulated field strength (HX) Figure A.7 – Typical plot of measured signal level and simulated field strength (Hz) |
| 27 | Annex B (informative) Discrete electric and magnetic field probes B.1 General B.2 Probe electrical description Figure B.1 – Electric and magnetic field probe schematics |
| 28 | B.3 Probe physical description B.3.1 General B.3.2 Electric field probe B.3.3 Magnetic field probe Figure B.2 – Example of electric field probe construction (EZ) |
| 29 | Figure B.3 – Example of magnetic field probe construction (HX or HY) |
| 30 | Annex C (informative) Combined electric and magnetic field probe example C.1 General C.2 Probe electrical description Figure C 1 – Electromagnetic field probe schematic |
| 31 | C.3 Probe physical description C.4 Measurement and data acquisition system Figure C.2 – Electromagnetic field probe construction |
| 32 | Figure C.3 – Measurement and data acquisition system overview Figure C.4 – Measurement and data acquisition system detail |
| 33 | Annex D (informative) Coordinate systems D.1 General D.2 Cartesian coordinate system Figure D.1 – Right-hand Cartesian coordinate system (preferred) |
| 34 | D.3 Cylindrical coordinate system Figure D.2 – Left-hand Cartesian coordinate system Figure D.3 – Cylindrical coordinate system |
| 35 | D.4 Spherical coordinate system D.5 Coordinate system conversion Figure D.4 – Spherical coordinate system Table D.1 – Coordinate system conversion |
| 36 | Bibliography |
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BSI PD IEC/TS 61967-3:2014
Integrated circuits. Measurement of electromagnetic emissions – Measurement of radiated emissions. Surface scan method Published…
