{"id":381150,"date":"2024-10-20T03:10:14","date_gmt":"2024-10-20T03:10:14","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-62878-2-6022021\/"},"modified":"2024-10-26T05:44:43","modified_gmt":"2024-10-26T05:44:43","slug":"bs-en-iec-62878-2-6022021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-62878-2-6022021\/","title":{"rendered":"BS EN IEC 62878-2-602:2021"},"content":{"rendered":"

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
8<\/td>\nFOREWORD <\/td>\n<\/tr>\n
10<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
11<\/td>\n1 Scope
2 Normative references
3 Terms and definitions
4 General
Figures
Figure 1 \u2013 Stackable electronic module <\/td>\n<\/tr>\n
12<\/td>\n5 Test apparatus
Figure 2 \u2013 Stacked electronic module <\/td>\n<\/tr>\n
13<\/td>\n6 Test specimen
6.1 General
Figure 3 \u2013 Test apparatus <\/td>\n<\/tr>\n
14<\/td>\n6.2 Preparation of test specimen
7 Evaluation test
7.1 Test method
7.2 Measurement
7.3 Test procedure
Figure 4 \u2013 Illustration of a typical test specimen <\/td>\n<\/tr>\n
15<\/td>\nFigure 5 \u2013 Input and output interface between test specimen and test apparatus <\/td>\n<\/tr>\n
16<\/td>\nAnnex A (informative)Specification of test specimen on outline size and terminal layout
Figure A.1 \u2013 Outline drawing of test specimen
Table A.1 \u2013 The final specifications <\/td>\n<\/tr>\n
17<\/td>\nAnnex B (informative)Representative examples of stacking assembly methods
Table B.1 \u2013 Representative examples of stacking assembly methods <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Device embedding assembly technology – Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2021<\/td>\n18<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":381158,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-381150","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/381150","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/381158"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=381150"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=381150"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=381150"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}