{"id":233320,"date":"2024-10-19T15:12:23","date_gmt":"2024-10-19T15:12:23","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-62047-102011\/"},"modified":"2024-10-25T09:41:46","modified_gmt":"2024-10-25T09:41:46","slug":"bs-en-62047-102011","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-62047-102011\/","title":{"rendered":"BS EN 62047-10:2011"},"content":{"rendered":"

This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.<\/p>\n

The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
6<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
7<\/td>\nFOREWORD <\/td>\n<\/tr>\n
9<\/td>\n1 Scope
2 Normative references
3 Symbols and designations
Figure 1 \u2013 Shape of cylindrical pillar (See Table 1 for symbols) <\/td>\n<\/tr>\n
10<\/td>\n4 Test piece
4.1 General
4.2 Shape of test piece
4.3 Measurement of dimensions
Table 1 \u2013 Symbols and designations of test piece <\/td>\n<\/tr>\n
11<\/td>\n5 Testing method and test apparatus
5.1 Test principle
5.2 Test machine
Figure 2 \u2013 Schematic of micro-pillar compression test <\/td>\n<\/tr>\n
12<\/td>\n5.3 Test procedure
5.4 Test environment
6 Test report <\/td>\n<\/tr>\n
14<\/td>\nAnnex A (informative) Error estimation using finite element method
Figure A.1 \u2013 Error estimation with the aspect ratio and friction coefficient in the elastic modulus measurement <\/td>\n<\/tr>\n
15<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Semiconductor devices. Micro-electromechanical devices – Micro-pillar compression test for MEMS materials<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2011<\/td>\n18<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":233323,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[577,2641],"product_tag":[],"class_list":{"0":"post-233320","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-99","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/233320","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/233323"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=233320"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=233320"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=233320"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}