{"id":232792,"date":"2024-10-19T15:10:08","date_gmt":"2024-10-19T15:10:08","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60749-212005\/"},"modified":"2024-10-25T09:36:48","modified_gmt":"2024-10-25T09:36:48","slug":"bs-en-60749-212005","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60749-212005\/","title":{"rendered":"BS EN 60749-21:2005"},"content":{"rendered":"
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
7<\/td>\n | Scope Test apparatus Solder bath Dipping device Optical equipment Steam ageing equipment <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | Lighting equipment Materials Flux Solder Tin-lead <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | Lead-free SMD reflow equipment Stencil or screen Rubber squeegee or metal spatula Test substrate Solder paste Pb-containing paste <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Pb-free paste Reflow equipment Flux removal solvent Procedure Preconditioning Preconditioning by steam ageing <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | Steam ageing procedure Cleaning of the system Drying and storage procedures Preconditioning by high temperature storage Procedure for dip and look solderability testing <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Solder dip conditions Procedure Preparation of terminations Ageing Application of flux Surface mounted devices All other devices <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Component termination attitude relative to flux and solder s Solder dip Solder dipping of gold plated terminations Solder bath contaminants control Inspection and failure criteria Inspection magnification Solder coverage <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Pinholes, voids, porosity, nonwetting, or dewetting Definition of the areas to be inspected <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Procedure for simulated board mounting reflow solderability <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Test equipment set-up <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Specimen preparation and surface condition <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Visual inspection Visual magnification criteria Accept\/reject criteria Summary <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Mechanical and climatic test methods – Solderability<\/b><\/p>\n |