{"id":232792,"date":"2024-10-19T15:10:08","date_gmt":"2024-10-19T15:10:08","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60749-212005\/"},"modified":"2024-10-25T09:36:48","modified_gmt":"2024-10-25T09:36:48","slug":"bs-en-60749-212005","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60749-212005\/","title":{"rendered":"BS EN 60749-21:2005"},"content":{"rendered":"

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
7<\/td>\nScope
Test apparatus
Solder bath
Dipping device
Optical equipment
Steam ageing equipment <\/td>\n<\/tr>\n
8<\/td>\nLighting equipment
Materials
Flux
Solder
Tin-lead <\/td>\n<\/tr>\n
9<\/td>\nLead-free
SMD reflow equipment
Stencil or screen
Rubber squeegee or metal spatula
Test substrate
Solder paste
Pb-containing paste <\/td>\n<\/tr>\n
10<\/td>\nPb-free paste
Reflow equipment
Flux removal solvent
Procedure
Preconditioning
Preconditioning by steam ageing <\/td>\n<\/tr>\n
11<\/td>\nSteam ageing procedure
Cleaning of the system
Drying and storage procedures
Preconditioning by high temperature storage
Procedure for dip and look solderability testing <\/td>\n<\/tr>\n
12<\/td>\nSolder dip conditions
Procedure
Preparation of terminations
Ageing
Application of flux
Surface mounted devices
All other devices <\/td>\n<\/tr>\n
13<\/td>\nComponent termination attitude relative to flux and solder s
Solder dip
Solder dipping of gold plated terminations
Solder bath contaminants control
Inspection and failure criteria
Inspection magnification
Solder coverage <\/td>\n<\/tr>\n
14<\/td>\nPinholes, voids, porosity, nonwetting, or dewetting
Definition of the areas to be inspected <\/td>\n<\/tr>\n
18<\/td>\nProcedure for simulated board mounting reflow solderability <\/td>\n<\/tr>\n
19<\/td>\nTest equipment set-up <\/td>\n<\/tr>\n
20<\/td>\nSpecimen preparation and surface condition <\/td>\n<\/tr>\n
21<\/td>\nVisual inspection
Visual magnification criteria
Accept\/reject criteria
Summary <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Semiconductor devices. Mechanical and climatic test methods – Solderability<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2005<\/td>\n24<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":232795,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[573,2641],"product_tag":[],"class_list":{"0":"post-232792","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-01","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/232792","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/232795"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=232792"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=232792"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=232792"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}