IEC 62047-26:2016
$50.05
Semiconductor devices – Micro-electromechanical devices – Part 26: Description and measurement methods for micro trench and needle structures
Published By | Publication Date | Number of Pages |
IEC | 2016-01-07 | 62 |
If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]
IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.
Published Code | IEC |
---|---|
Published By | International Electrotechnical Commission |
Publication Date | 2016-01-07 |
Pages Count | 62 |
Language | France |
Edition | 1.0 |
File Size | 1.9 MB |
ICS Codes | 31.080.99 - Other semiconductor devices |
Related products
-
BS 6207-1:1995
Mineral insulated cables with a rated voltage not exceeding 750 V – Cables Published By…
-
BS EN IEC 62077:2022
Fibre optic interconnecting devices and passive components. Fibre optic circulators. Generic specification Published By Publication…
-
BS EN 60745-2-17:2010:2011 Edition
Hand-held motor-operated electric tools. Safety – Particular requirements for routers and trimmers Published By Publication…
-
BS EN 60738-1:2006+A1:2009:2010 Edition
Thermistors. Directly heated positive temperature coefficient – Generic specification Published By Publication Date Number of…
-
BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices – Four-point bending test method for interfacial adhesion energy of layered…
-
BS EN 62027:2012
Preparation of object lists, including parts lists Published By Publication Date Number of Pages BSI…
-
BS EN 62047-17:2015
Semiconductor devices. Micro-electromechanical devices – Bulge test method for measuring mechanical properties of thin films…
-
BS EN 62040-1-1:2003:2004 Edition
Uninterruptible power systems (UPS) – General and safety requirements for UPS used in operator access…
-
BS EN 62047-5:2011:2013 Edition
Semiconductor devices. Micro-electromechanical devices – RF MEMS switches Published By Publication Date Number of Pages…
-
BS EN 60099-8:2011
Surge arresters – Metal-oxide surge arresters with external series gap (EGLA) for overhead transmission and…
-
BS EN 62007-1:2015
Semiconductor optoelectronic devices for fibre optic system applications – Specification template for essential ratings and…
-
BS EN IEC 62040-3:2021
Uninterruptible power systems (UPS) – Method of specifying the performance and test requirements Published By…
-
BS EN 62047-20:2014
Semiconductor devices. Micro-electromechanical devices – Gyroscopes Published By Publication Date Number of Pages BSI 2014…
-
BS EN 16014:2011
Hardware for furniture. Strength and durability of locking mechanisms Published By Publication Date Number of…
-
BS EN 62047-19:2013
Semiconductor devices. Micro-electromechanical devices – Electronic compasses Published By Publication Date Number of Pages BSI…
-
BS EN 60702-1:2002+A1:2015
Mineral insulated cables and their terminations with a rated voltage not exceeding 750 V –…
-
BSI PD IEC/TS 62647-22:2013
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Technical guidelines…
-
BS EN 62040-1-2:2003:2004 Edition
Uninterruptible power systems (UPS) – General and safety requirements for UPS used in restricted access…
-
BS EN IEC 62040-1:2019+A11:2021
Uninterruptible power systems (UPS) – Safety requirements Published By Publication Date Number of Pages BSI…
-
BS EN 61837-1:2012
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections…
-
BS EN IEC 62041:2020
Transformers, power supplies, reactors and similar products. EMC requirements Published By Publication Date Number of…
-
BS EN 62040-3:2011:2012 Edition
Uninterruptible power systems (UPS) – Method of specifying the performance and test requirements Published By…
-
BS EN IEC 62040-1:2019+A1:2023
Uninterruptible power systems (UPS) – Safety requirements Published By Publication Date Number of Pages BSI…
-
BS EN 62047-5:2011:2013 Edition
Semiconductor devices. Micro-electromechanical devices – RF MEMS switches Published By Publication Date Number of Pages…
-
BSI DD IEC/PAS 62647-3:2011
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Performance testing…
-
BS EN IEC 62040-3:2021
Uninterruptible power systems (UPS) – Method of specifying the performance and test requirements Published By…
-
BS EN 62047-9:2011:2013 Edition
Semiconductor devices. Micro-electromechanical devices – Wafer to wafer bonding strength measurement for MEMS Published By…
-
BSI PD IEC/TS 62647-23:2013
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Rework and…
-
BS EN 62040-1:2008+A1:2013
Uninterruptible power systems (UPS) – General and safety requirements for UPS Published By Publication Date…
-
BS EN IEC 62941:2020
Terrestrial photovoltaic (PV) modules. Quality system for PV module manufacturing Published By Publication Date Number…
-
BS EN 62047-26:2016
Semiconductor devices. Micro-electromechanical devices – Description and measurement methods for micro trench and needle structures…
-
BS EN 61837-1:2012
Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections…
-
BS EN 62040-2:2006 2012
Uninterruptible power systems (UPS) – Electromagnetic compatibility (EMC) requirements Published By Publication Date Number of…
-
BS EN 62341-5-3:2013
Organic Light Emitting Diode (OLED) displays – Measuring methods of image sticking and lifetime Published…
-
BS EN 62047-7:2011
Semiconductor devices. Micro-electromechanical devices – MEMS BAW filter and duplexer for radio frequency control and…
-
BSI DD IEC/PAS 62647-23:2011
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Rework and…
-
BS EN 60793-2-30:2009
Optical fibres – Product specifications. Sectional specification for category A3 multimode fibres Published By Publication…
-
BS EN 62047-9:2011:2013 Edition
Semiconductor devices. Micro-electromechanical devices – Wafer to wafer bonding strength measurement for MEMS Published By…
-
BSI PD IEC/TS 62647-23:2013
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Rework and…
-
BS EN 62027:2001
Preparation of parts lists Published By Publication Date Number of Pages BSI 2001 30