IEC 60191-3:1999
$68.90
Mechanical standardization of semiconductor devices – Part 3: General rules for the preparation of outline drawings of integrated circuits
| Published By | Publication Date | Number of Pages |
| IEC | 1999-10-29 | 122 |
Gives guidance on the preparation of drawings of integrated circuits outlines.
Related products
-
BS 3934-5:1997
Mechanical standardization of semiconductor devices – Recommendations applying to tape automated bonding (TAB) of integratedā¦
-
BS IEC 60191-1:2007
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings ofā¦
-
BS 3934-1:1992
Mechanical standardization of semiconductor devices – Recommendations for the preparation of drawings of semiconductor devicesā¦
-
BS EN 61191-2:2013
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publicationā¦
-
BS EN 60191-6:2004:2005 Edition
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings ofā¦
-
BS EN 60691:1996:2003 Edition
Thermal links. Requirements and application guide Published By Publication Date Number of Pages BSI 2003ā¦
-
BS EN 61191-4:1999
Printed board assemblies – Sectional specification. Requirements for terminal soldered assemblies Published By Publication Dateā¦
-
BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices – Dimensions Published By Publication Date Number of Pages BSIā¦
-
BS EN 60603-2:1998:2006 Edition
Connectors for frequencies below 3 MHz for use with printed boards – Detail specification forā¦
-
BS 3934-3:1992
Mechanical standardization of semiconductor devices – Recommendations for the preparation of outline drawings of integratedā¦
-
BS EN 60191-3:2000
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings ofā¦
-
BS EN 60286-4:2013
Packaging of components for automatic handling – Stick magazines for electronic components encapsulated in packagesā¦
-
BS EN 61191-3:1999
Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies Published By Publicationā¦
-
BS AU 50-1.1.4b:1996:1999 Edition
Tyres and wheels. Tyres. Car tyres – Method of test for verifying tyre capabilities Publishedā¦
-
IEC 60191-2W:1999
Twenty-first supplement Published By Publication Date Number of Pages IEC 1999-07-29 34
-
BS EN 61190-1-2:2007
Attachment materials for electronic assembly – Requirements for soldering pastes for high-quality interconnects in electronicsā¦
-
BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices – Dimensions Published By Publication Date Number of Pages BSIā¦
-
BS AU 50-1.1.4:1994
Tyres and wheels. Tyres. Car tyres – Method of test for verifying tyre capabilities Publishedā¦
-
BS 5768:1979
Specification for operating instrumentation for earth-moving machinery Published By Publication Date Number of Pages BSIā¦
-
BS 3767:1990
Specification for low pressure sodium vapour lamps Published By Publication Date Number of Pages BSIā¦
-
BS EN 60192:2001
Low pressure sodium vapour lamps. Performance specification Published By Publication Date Number of Pages BSIā¦
-
BS 3934-5:1992
Mechanical standardization of semiconductor devices – Recommendations for tape automated bonding (TAB) of integrated circuitsā¦
-
BS EN 123200-800:1992:1990 Edition
Harmonized system of quality assessment for electronic components: capability detail specification: single and double sidedā¦
-
CAN/CSA-E60691-08 (R2012):2008 Edition
Thermal-Links – Requirements and Application Guide Published By Publication Date Number of Pages CSA 2008ā¦
-
BS EN 60191-4:2000:2003 Edition
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlinesā¦
-
BS EN 61191-4:2017
Printed board assemblies – Sectional specification. Requirements for terminal soldered assemblies Published By Publication Dateā¦
-
BS EN 60891:1995
Procedures for temperature and irradiance corrections to measured I-V characteristics of crystalline silicon photovoltaic devicesā¦
-
BS EN 60477-2:1999
Laboratory resistors – Laboratory a.c. resistors Published By Publication Date Number of Pages BSI 1999ā¦
-
BS 3934-4:1992
Mechanical standardization of semiconductor devices – Recommendations for a coding system and classification into formsā¦
-
BS EN 61191-1:2013
Printed board assemblies – Generic specification. Requirements for soldered electrical and electronic assemblies using surfaceā¦
-
BS EN 60891:2010
Photovoltaic devices. Procedures for temperature and irradiance corrections to measured I-V characteristics Published By Publicationā¦
-
BS EN 60691:2003+A2:2010
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2010 44
-
BS EN 61191-3:2017
Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies Published By Publicationā¦
-
BS EN 61191-2:1999
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publicationā¦
-
BS ISO/IEC 3309:1991:1992 Edition
Information technology. Telecommunications and information exchange between systems. High-level Data Link Control (HDLC) procedures. Frameā¦
-
IEC 61191-3:1998
Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assembliesā¦
-
BS 3934-6:1992
Mechanical standardization of semiconductor devices – Specification for the preparation of outline drawings of surfaceā¦
-
IEC 60191-2X:1999
Mechanical standardization of semiconductor devices – Part 2: Dimensions Published By Publication Date Number ofā¦
-
BS 3934:1965
Specification for dimensions of semiconductor devices and integrated electronic circuits Published By Publication Date Numberā¦
-
BS CECC 00803:1996
Harmonized system of quality assessment for electronic components. Guidance document:visual inspection of soldered surface mountedā¦
