DIN EN IEC 60749-20-1:2018 Edition

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Semiconductor devices – Mechanical and climatic test methods – Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (Draft)

Published By	Publication Date	Number of Pages
DIN	2018-11	79

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Categories: 31.080.01 - Semiconductor devices in general, DIN

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Description

This part of series DIN EN 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices that are exposed to the ambient air. It provides standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20.

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2018-11
Pages Count	79
Language	Germany
Descriptors	Climatic tests, Components, Definitions, Electrical engineering, Electronic engineering, Electronic equipment and components, Graphic symbols, Heat, Integrated circuits, Labelling, Mechanical testing, Moisture, Moisture resistance, Packages, Packaging tests, Plastics, Reflow soldering, Resistance, Semiconductor devices, Semiconductors, Shipping, SMD, Soldering heat, Soldering temperature resistance, Surface mounting, Surface mounting devices, Testing, Transport
File Size	1.6 MB
ICS Codes	31.080.01 - Semiconductor devices in general