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BSI PD IEC/PAS 62647-1:2011:2012 Edition

$142.49

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Lead-free management

Published By Publication Date Number of Pages
BSI 2012 24
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IEC/PAS 62647-1:2011(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and high performance electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. The goal is to communicate requirements for a Lead-free Control Plan (LFCP) and to assist suppliers in the development of their own plans.

PDF Catalog

PDF Pages PDF Title
4 CONTENTS
6 FOREWORD
8 INTRODUCTION
9 1 Scope
2 Normative references
10 3 Terms and definitions
12 4 Symbols and abbreviated terms
5 Objectives
5.1 General
5.2 Reliability
5.3 Configuration control and product identification
5.4 Risks and limitations of use
5.5 Deleterious effects of tin whiskers
5.6 Repair, rework, maintenance, and support
6 Technical requirements
6.1 General
13 6.2 Reliability
14 6.3 Configuration control and product identification
16 6.4 Risks and limitations of use
6.5 Deleterious effects of tin whiskers
6.6 Repair, rework, maintenance, and support
17 7 Plan administrative requirements
7.1 Plan organization
7.2 Terms and definitions
18 7.3 Plan focal authority
7.4 References
7.5 Plan applicability
7.6 Plan implementation
7.7 Plan acceptance
7.8 Plan modifications
19 Figure 1 – Relationship of IEC/PAS 62647-1, IEC/PAS 62647-2, GEIA-HB-0005-1, and GEIA-HB-0005-2 with each other, and with information about Pb-free electronics from sources external to the aerospace and high performance electronics industries
Figure 2 – Schematic diagram of the content of a performance plan compliant to IEC/PAS 62647-1
20 Bibliography
BSI PD IEC/PAS 62647-1:2011
$142.49