BS EN 62047-10:2011
$102.76
Semiconductor devices. Micro-electromechanical devices – Micro-pillar compression test for MEMS materials
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 18 |
This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | FOREWORD |
| 9 | 1 Scope 2 Normative references 3 Symbols and designations Figure 1 – Shape of cylindrical pillar (See Table 1 for symbols) |
| 10 | 4 Test piece 4.1 General 4.2 Shape of test piece 4.3 Measurement of dimensions Table 1 – Symbols and designations of test piece |
| 11 | 5 Testing method and test apparatus 5.1 Test principle 5.2 Test machine Figure 2 – Schematic of micro-pillar compression test |
| 12 | 5.3 Test procedure 5.4 Test environment 6 Test report |
| 14 | Annex A (informative) Error estimation using finite element method Figure A.1 – Error estimation with the aspect ratio and friction coefficient in the elastic modulus measurement |
| 15 | Bibliography |
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BS EN 62047-10:2011
Semiconductor devices. Micro-electromechanical devices – Micro-pillar compression test for MEMS materials Published By Publication Date…
