ASTM-F1709:2008 Edition
$35.75
F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
| Published By | Publication Date | Number of Pages |
| ASTM | 2008 | 3 |
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.
1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.
1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | Scope Referenced Documents Terminology Classification Ordering Information Impurities TABLE 1 TABLE 2 |
| 2 | Grain Size Configuration Workmanship, Finish, Appearance Sampling Analytical Methods Certification Packaging Keywords |
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